Solvay has expanded FusePly its chemical bonding range with FusePly 250, designed to bond composite structures at temperatures of 250°F and higher.

The new product complements the previous FusePly 100 grade introduced in 2018, which has now been renamed FusePly 350 to reflect its compatibility with 350°F cure film adhesives.

Both grades offer step-change bonding performance and durability and can be easily integrated into existing manufacturing processes as an upgrade for traditional surface preparation methods.

FusePly is a breakthrough composite bonding technology resulting in covalent bonds between adhesives and composite structures. While it handles and processes like a conventional peel ply product, it creates a reliable chemically functionalised composite surface which eliminates time and labour intensive-surface preparation steps and assembly processes.

“The reliability and robustness of bonded structures are top priorities for users of composites in safety-critical applications in aerospace and other demanding markets” says Stephen Heinz, VP of research and innovation for Solvay’s Composite Materials business. “We developed FusePly, a fundamentally new bonding approach, to meet the needs of leading aircraft OEMs and enable them to take full advantage of composites for lighter, stronger structures.”

FusePly 250 will officially be launched at the upcoming CAMX Composites and Advanced Materials Expo in Atlanta from October 30 to November 02.

www.solvay.com