Hollingsworth & Vose has introduced its ViaMat aramid paper as a new nonwoven organic reinforcement material for electronic packaging. The new ViaMat paper delivers improvements in dimensional stability and enables higher interconnect densities.

“ViaMat paper fills the void created by the technical limitations of woven glass in advanced high-performance electronic packaging applications,” said Nate Burnes, Business Manager for Advanced Fiber Nonwovens (AFN) at Hollingsworth & Vose.

For manufacturers of PCBs on woven glass reinforcement, ViaMat paper provides a path of opportunity to expand their product offerings into high performance electronics applications such as avionics, portable electronics, medical devices, and high capacity servers, the company says.

Hollingsworth & Vose’s new ViaMat nonwoven aramid paper features:

• Extreme surface smoothness for uniform resin application
• Low CTE (Coefficient of Thermal Expansion) for excellent dimensional stability as aramid fibres exhibit a negative CTE and restrain expansion of applied resins
• Saturation of ViaMat paper can be processed on most existing glass resin saturation lines with minimal capital investment
• Randomly aligned fibres create an isotropic nonwoven paper for uniform density and resin pickup
• Excellent laser/plasma ablation and drillability allowing for increased interconnect density over industry standard woven materials

ViaMat nonwoven aramid paper rolls are manufactured in the United States and are immediately available for evaluation.

About H&V

Established in 1843, Hollingsworth & Vose Company (www.hollingsworth-vose.com ) is a global leader in the supply of technically advanced nonwovens for electronics and industrial applications; engine, high efficiency and liquid filtration media; and battery separator materials. H&V’s expertise and process capabilities include wet-laid, dry-laid, meltblown and composite technologies. The company operates manufacturing sites and research centres in the Americas, Europe, and Asia.